Akita Elpida Develops World's Densest MCPs
April 27, 2007
Akita Elpida, a semiconductor company formed by Japanese Elpida Memory, announced that it has developed advanced MCP (Multi-chip Package) technology capable of stacking a 1.4mm package with 20 dies, thereby creating a MCP featuring the highest density in the world. Akita Elpida will develop low-cost, high-capacity packaging technology based on this technology.